Samsung Electro-Mechanics’ Executive Kim Wi-heon Receives Industrial Medal for MLCC Core Technology Development
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Samsung Electro-Mechanics said that Kim Wi-heon, an executive director and head of the MLCC Manufacturing Technology Team, received an Industrial Medal at the '21st Electronics and IT Day' awards ceremony held on the 13th.
Kim was recognized for leading the development of core new products and core technologies in the MLCC field for 26 years and for contributing to the localization of high-value-added MLCCs for IT and automotive electronics use as well as to global competitiveness.
He developed the world's first 0603-size 1 μF MLCC in 2009, the world's first 2.2 μF MLCC of the same size in 2011, and the industry's first high-capacity MLCC for automotive electronics in 2022 and 2023.
Samsung Electro-Mechanics announced that Kim Wi-heon, head of the MLCC Manufacturing Technology Team and an executive director, received an Industrial Medal at the '21st Electronics and IT Day' awards ceremony held on the 13th.
Kim was recognized for contributing to the development of core multilayer ceramic capacitor (MLCC) technologies, promoting MLCC localization, and helping strengthen the competitiveness of the domestic electronics and automotive electronics component industries.
The award recognized his 26 years of work in the MLCC field, during which he led the development of key new MLCC products and core MLCC technologies, and contributed to the localization of high-value-added MLCCs for IT and automotive electronics use as well as to global competitiveness. Kim joined Samsung Electro-Mechanics in 2000 and has worked as an MLCC product development specialist.
Kim led the development of core MLCC technologies for IT use and automotive electronics use, as well as new MLCC products for both segments. In particular, he led technology development that simultaneously met the miniaturization and higher-capacity demands in the MLCC field, contributing to securing the technological competitiveness of the domestic electronic components industry.
In 2009, he developed the world's first 0603-size (0.6 mm wide, 0.3 mm long) 1 μF MLCC, and in 2011 he unveiled the world's first 2.2 μF MLCC of the same size. Through these achievements, he secured core component technologies for responding to the high-performance and thinner design trends of smartphones and helped strengthen the competitiveness of domestic companies in high-value-added IT MLCCs.
He later began developing key automotive electronics materials and process technologies based on his experience in IT MLCC development, and in 2022 developed the industry's first high-capacity MLCC for automotive electronics. He then developed another industry-first high-capacity MLCC for automotive electronics in 2023, contributing to securing technological competitiveness in the automotive electronics components sector.
Since 2024, he has served as head of the MLCC Manufacturing Technology Team in the Component Business Division, and since the same year he has been leading MLCC development for AI servers. As demand for high-performance, high-reliability components expands in the AI server market, he is pursuing the timely development and supply of high-value-added MLCCs to global semiconductor companies, with the goal of expanding related businesses and strengthening technological competitiveness.
Electronics and IT Day was established in 2005 to mark the breakthrough of $100 billion in exports by the domestic electronics and IT industries. Since then, it has been operated annually as an event that selects individuals who have contributed to the development of the electronics and IT industries and to enhancing the nation's standing, and presents Industrial Medals, Orders of Industrial Service Merit, Presidential Citations, Prime Minister's Citations, and ministerial citations.
Kim said he would respond to the growth of future industries such as artificial intelligence (AI) and automotive electronics by pursuing the preemptive development of high-value-added MLCC technologies and products. He added that he intends to lead efforts to strengthen the competitiveness of the domestic electronic components industry through these initiatives.
Source: TECHWORLD · Park Gyu-chan
Original: https://www.epnc.co.kr/news/articleView.html?idxno=408076
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Source: TECHWORLD
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