Infineon Launches 27 kW Three-Phase PSU Solution for Next-Gen AI Server Power Architectures
TECHWORLD ·
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Infineon Technologies said it has launched a 27 kW three-phase PSU solution for server ODMs and OEMs.
It said the solution, as a reference design, meets the OCP Open Rack (Open Rack) V3 (ORV3) specifications and the requirements of AI server rack architectures.
The reference design delivers more than 98% peak efficiency, a power density of 116W/in³, and a hold-up time of 20 ms under 480VAC input voltage and 50% load conditions.
AI workloads are redefining the power demands of modern data centers. Improvements in GPU performance and rising server rack density are accelerating this shift, and the transition to 800VDC or ±400VDC power delivery architectures is also picking up speed.
Infineon Technologies said it has launched a 27 kW three-phase power supply unit (PSU) solution for server ODMs and OEMs in response to these demands.
Infineon said the solution, as a reference design, meets the OCP Open Rack (Open Rack) V3 (ORV3) specifications and also satisfies the requirements of AI server rack architectures. It added that the product expands its comprehensive portfolio for AI server power delivery.
Infineon said the solution helps developers shorten time to market and also supports higher rack power density, improved efficiency, and better thermal performance.
The reference design is built with Infineon components and was designed by combining 650V CoolSiC·CoolMOS MOSFETs, EiceDRIVER gate drivers, XENSIV current sensors, and PSOC microcontrollers.
The reference design consists of a 5-level ANPC PFC topology and a 3-level LLC converter. This enabled it to achieve a peak efficiency of more than 98% under 480VAC input voltage and 50% load conditions.
It also delivers a power density of 116W/in³, which exceeds the ORV3 minimum requirement of 94W/in³.
In addition, the use of an integrated energy buffer provides a hold-up time of 20 ms during temporary grid disturbances and supports line voltage stabilization during sudden GPU load changes. As a result, a separate capacitor bank unit (CBU) is not necessary. The integrated planar magnetic structure also supports a compact, modular, and scalable high-frequency transformer design.
For the PFC and LLC stages, digital control is used for control purposes to respond to demanding AI load transients, and this response performance is supported by the programmable power control accelerator (PPCA) integrated into the PSOC Control C3 Performance Line microcontroller, which enables fast dynamic response as well as precise current and voltage control.
Source: TECHWORLD · Lee Gwang-jae
Original: https://www.epnc.co.kr/news/articleView.html?idxno=408009
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Source: TECHWORLD
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