SemiFive, Mobilint to Co-Develop Turnkey AI Chip for Robots
TECHWORLD ·
✦ AI Summary
SemiFive said it has signed a contract with Mobilint to develop an AI chip for industrial robots.
The collaboration will proceed as part of the Ministry of Trade, Industry and Energy-led 'K-Device AI Semiconductor Technology Development' project.
The two companies plan to develop an AI chip for robots that processes vision and sensor data in real time in outdoor environments where external server connections are difficult.
SemiFive and Mobilint have signed a turnkey development contract for an AI chip for industrial robots. SemiFive said on the 1st that it had signed an agreement to develop an AI chip for industrial robots in partnership with AI semiconductor company Mobilint.
The collaboration will be carried out as part of the Ministry of Trade, Industry and Energy-led "K-Device AI Semiconductor Technology Development" project. The project aims to develop and verify semiconductors needed for industry-specific products based on cooperation between domestic AI semiconductor companies and demand-side companies.
The core of the project is to support the commercialization of actual products after technology development. The partnership between SemiFive and Mobilint will also proceed on this basis.
The two companies plan to build an AI chip for robots that can respond to outdoor environments where external server connections are difficult. The chip aims to perform independent, high-performance AI computing and is being developed to process vision and sensor data in real time across a range of environments, with plans to install it in agricultural robots and others.
The project will adopt SemiFive's turnkey model, the "Spec Hand-off" approach. Under this method, the customer presents the core performance targets and required specifications.
Based on that, SemiFive provides detailed design, packaging, testing, and mass production. This is an integrated offering covering the full ASIC development process.
This approach contrasts with the traditional model, in which the customer completes much of the design before taking charge of subsequent steps. The differentiating point of "Spec Hand-off" is that it supports the entire semiconductor implementation process from the earliest stages of development.
The project will apply LPDDR6, the latest low-power DRAM standard, PCIe Gen6, a high-speed interface, and UCIe-S(Universal Chiplet Interconnect Express) technology, which connects multiple function-specific chiplets within a single package. The goal is to secure the performance and power efficiency of the AI chip for robots through this.
SemiFive plans to respond to outdoor environments with limited external network connectivity. It plans to support real-time processing of vision and sensor data in environments including areas with poor communications coverage. Through this, it aims to reduce data bottlenecks and support stable AI computing.
SemiFive CEO Cho Myung-hyun said the order marks an opportunity to expand the company's full-stack ASIC capabilities accumulated in data centers and edge AI into robotics AI in earnest. He also said the company intends to expand its influence across advanced industries as a leader in customized semiconductors. SemiFive is planning to broaden its ASIC development capabilities accumulated in data centers, high-performance computing (HPC), and edge AI into robotics AI.
Based on its partnership with Mobilint, SemiFive plans to strengthen the domestic AI semiconductor ecosystem while expanding its business into the next-generation robotics platform market.
Source: TECHWORLD · Park Kyu-chan
Original: https://www.epnc.co.kr/news/articleView.html?idxno=407630
References
This article was produced with the help of an automated content generation algorithm.
Source: TECHWORLD
View originalThis article was summarized and organized by BizCrush based on the original article from TECHWORLD. For exact quotations and full details, please refer to the original article.