PIE to Unveil High-Precision AI Vision and Physical AI Robot Solutions at VISION 2026
TECHWORLD ·
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PIE announced its participation in the machine vision exhibition 'VISION 2026.'
The event runs from the 6th to the 8th this year at the Stuttgart Trade Fair Center in Germany.
PIE plans to unveil next-generation automotive and advanced substrate vision inspection solutions at the exhibition.
PIE announced that it will participate in the machine vision exhibition "VISION 2026." At "VISION 2026," PIE plans to unveil next-generation automotive and advanced substrate vision inspection solutions.
"VISION 2026" is an exhibition for machine vision and the latest camera and sensor technologies. The event runs from the 6th to the 8th this year at the Stuttgart Trade Fair Center in Germany.
At this exhibition, PIE will focus on an integrated automotive inspection solution for global automakers and parts suppliers. The solution combines advanced vision technology with robotic systems.
Through the exhibition, PIE plans to expand its network of global automakers, global IT companies, and automation robot partners based in Stuttgart. It also plans to push ahead with building a practical order pipeline.
As a technology unveiling, PIE plans to showcase multi-angle inspection of 3D curved lamp covers based on high-performance industrial robot precision control.
PIE presented technology that applies AI vision algorithms to read minor surface defects in individual lamps in real time and also to read defects in finished automotive lamps in real time. It also included technologies for battery label inspection, battery appearance inspection, torque matching, and connector defect inspection. This is a strategy to meet the increasingly advanced yield requirements of the finished vehicle market, which has become more complex amid the expansion of smart cars and electrification.
PIE also presented a lineup of advanced vision solutions for next-generation semiconductor and high-density substrate manufacturing processes. As glass substrates are being identified as a key material for next-generation semiconductor packaging, it unveiled TGV AOI for glass substrates, holography for glass substrates, and processing-surface inspection and metrology solutions for glass substrates.
It also unveiled PTH AOI for quality control in high-layer, high-precision PCB processes and blind via metrology technology for high-layer, high-precision PCB processes. Through this, PIE aims to expand its applications beyond automobiles to semiconductor and advanced IT manufacturing processes and demonstrate comprehensive manufacturing intelligence capabilities across mobility, advanced IT, and semiconductors.
PIE said that, as global automakers, robotics companies, and advanced manufacturing firms gather at this exhibition, it sees the event as an important opportunity to introduce high-precision AI inspection solutions to the European market. It added that it plans to use the exhibition as a springboard to target the European market and expand PIE Group's global business, while strengthening local supply-chain partnerships and broadening its business areas from semiconductors to mobility and advanced substrates.
Source: TECHWORLD · Lee Gwang-jae
Original: https://www.epnc.co.kr/news/articleView.html?idxno=407614
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Source: TECHWORLD
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