LG Electronics Targets AI Data Center Market With Block-Type Modular Cooling
TECHWORLD ·
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LG Electronics unveiled a total solution covering thermal management, power, and operations for AI data centers at 'Data Centre World Asia (DCWA) 2026' in Singapore.
Its key solution is 'Hydronic Modular,' which integrates pumps, valves, and an emergency buffer tank and is premanufactured inside an ISO standard container.
LG Electronics is targeting the AI data center market with a 'One LG' integrated solution that includes CDUs ranging from 600kW-class to various MW-class products, as well as liquid cooling and immersion cooling technologies.
LG Electronics has begun targeting the global AI data center market. The company is banking on modular cooling infrastructure as its means of attack. The infrastructure is aimed at shortening AI data center build times and easing the upfront investment burden.
LG Electronics participated in 'Data Centre World Asia (DCWA) 2026,' which opened in Singapore on the 29th. 'Data Centre World Asia (DCWA) 2026' is Asia's largest data center exhibition. At the event, LG Electronics unveiled a total solution covering thermal management, power, and operations for AI data centers.
The key solution unveiled for the first time at this exhibition was 'Hydronic Modular.' 'Hydronic Modular' consists of a single unit integrating cooling equipment such as pumps, valves, and an emergency buffer tank. The solution is premanufactured in a finished form inside an ISO standard container.
Under the conventional method, multiple pumps and pipes had to be welded and assembled on-site to supply chilled water produced by the Chiller to the server room. By contrast, the 'Hydronic Modular' approach supplies premanufactured related equipment. As a result, the cooling system can be built on-site simply by connecting the Chiller main body to the module.
As AI servers become denser and demand grows for the rapid construction of large-scale AI data centers, plans to use modular methods are emerging. This approach aims to shorten build times and reduce the upfront investment burden, while also responding to future server expansion. Because standardized modules can be added in the required quantities, facilities investment can be aligned with data center demand and expansion plans.
In line with this trend, LG Electronics displayed an air-cooled oil-free inverter turbo Chiller for AI data centers. The product uses an oil-free compressor based on magnetic bearings to reduce friction losses and improve cooling efficiency. It also incorporates refrigerant free-cooling technology, which cools heat by allowing condensed refrigerant to self-circulate using outside air cooling while the compressor is stopped.
LG Electronics also unveiled the 'Fan Wall Unit (FWU).' The 'Fan Wall Unit (FWU)' is designed to supply cold air inside AI data centers and exhaust heat. It also features the ability to provide uniform cooling performance in high-heat environments while minimizing energy use.
LG Electronics said it included liquid cooling solutions among its major exhibits and has a lineup of CDUs ranging from 600kW-class to various MW-class products. At this exhibition, it unveiled 1MW-class and 2.6MW-class CDUs.
The CDU is a core piece of equipment in liquid cooling systems, circulating cooling water to cold plates equipped with GPUs and CPUs in high-density AI servers and recovering heat from the chip. This method can be applied alongside existing air-cooling systems and is intended to respond to the high-heat environment of data centers.
LG Electronics' 600kW-class CDU, 1MW-class CDU, and 2.6MW-class CDU have received NVIDIA quality specification approval. Based on this NVIDIA approval, LG Electronics plans to expand its liquid cooling supply chain for high-density AI data center servers.
LG Electronics is also developing immersion cooling technology. Immersion cooling is a method of cooling heat-generating electronic devices such as data center servers by directly immersing them in a special nonconductive cooling fluid, and LG Electronics plans to expand its cooling portfolio with a 'Chip to Chiller' total solution that covers the entire thermal management process, from the Chiller's chilled water production to the CDU's chilled water distribution and the cold plate's direct absorption of chip heat.
At this exhibition, LG Electronics unveiled an integrated 'One LG' solution involving its affiliates. The 'One LG' integrated solution covers the design, manufacturing, transport, build, operation, and expansion of AI data centers.
Within this integrated framework, LG Electronics handles cooling technology, LG Energy Solution is responsible for battery solutions for data centers, and LG CNS takes on data center design, build, and operation capabilities.
LG Energy Solution introduced the '2170 cylindrical battery' for BBU, the BESS 'JF2 DC Link,' and the UPS 'JP5 UPS battery' as products related to data center power supply and storage. The '2170 cylindrical battery' is mounted in server racks and is designed to supply DC power immediately when needed.
LG CNS unveiled the 'Prefabricated Modular Data Center (PMDC)' and the 'AI Factory Full-Stack Service.' The PMDC method standardizes modules for AI factory implementation, including GPUs, servers, power, and cooling equipment, and premanufactures them before installing them on-site.
Lee Jae-seong, head of LG Electronics' ES Business Division, said the company aims to emerge as a key partner in the global AI infrastructure market by leading with a total cooling solution optimized for ultra-large AI data centers.
In line with this, LG Electronics plans to combine cooling with power capabilities and data center build and operation capabilities, while expanding cooperation opportunities across the broader AI infrastructure business.
Source: TECHWORLD · Park Gyu-chan
Original: https://www.epnc.co.kr/news/articleView.html?idxno=407457
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Source: TECHWORLD
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