LG Electronics Secures Nvidia 'DSX Ready' Approval for 2.5MW Liquid-Cooling CDU
TECHWORLD ·
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LG Electronics announced on the 22nd that it had secured Nvidia's 'DSX Ready' approval for a 2.5MW liquid-cooling CDU.
Nvidia conducted the AI factory specification approval process for LG Electronics' 2.5MW CDU, and LG Electronics met all requirements, including additional ones.
LG Electronics has secured Nvidia specification approval for 600KW, 1MW, and now 2.5MW CDUs, and plans to accelerate its push into the global AI data center cooling market based on this momentum.
LG Electronics announced on the 22nd that it had secured Nvidia's 'DSX Ready' approval for a 2.5MW liquid-cooling CDU. Nvidia conducted the AI factory specification approval process for LG Electronics' 2.5MW CDU, and LG Electronics met all requirements, including additional ones. As a result, the product was recognized as a 'DSX Ready CDU' product.
Nvidia operates the 'Nvidia DSX AI Factory Platform.' The platform integrates AI factory design and operations across computing, networking, power, cooling, facilities, and software. Nvidia grants 'DSX Ready' approval only to products that meet the relevant requirements.
The CDU category covers large-capacity products of 2.3MW or more for AI factory buildout. Based on this approval, LG Electronics plans to accelerate its push into the global AI data center cooling market.
After securing Nvidia specification approval for a 600KW CDU in July and for a 1MW CDU in September, LG Electronics has now also secured Nvidia specification approval for a 2.5MW CDU. This 2.5MW CDU also met additional requirements.
The 2.5MW CDU also received 'DSX Ready' approval. The approval demonstrates the company's technological strength in large-capacity liquid-cooling solutions.
LG Energy Solution's battery energy storage system (BESS) was also approved as a DSX Ready product on the same day.
LG Electronics' 2.5MW CDU is a key piece of equipment for thermal management in highly dense AI data centers. With the recent introduction of next-generation AI accelerators based on Nvidia's Blackwell architecture and advances in AI chip performance, server rack power density has risen to more than hundreds of KW and into the megawatt range.
Accordingly, cooling methods are expanding from the small-capacity 'In-Rack' format for individual racks to the large-capacity 'In-Row' format, which groups multiple racks by Row. The 'In-Row' method cools multiple racks at once with a large-capacity CDU.
A 2.5MW large-capacity CDU is a key piece of equipment for stable thermal management in highly dense, high-heat AI data centers. The latest AI server rack capacity is about 120KW, and if 20 cooling groups are configured, the scale reaches about 2.4 to 2.5MW. As a result, 2.5MW has become established as the standard for large-capacity CDUs.
Along with this trend, market expectations for the expansion of liquid cooling in AI data centers are also being reflected. TrendForce forecast that the adoption rate of liquid-cooling solutions in AI data centers will rise from 14% in 2024 to about 60% in 2027. Dell'Oro Group analyzed that next-generation chipset power is increasing and said liquid cooling is becoming a key foundational technology for AI factories.
LG Electronics secured Nvidia specification approval for its 2.5MW CDU. Through this approval, LG Electronics expanded its lineup of cooling solutions for AI data center thermal management.
LG Electronics has high-efficiency chillers and computer room air handlers (CRAH), and these facilities include traditional air-conditioning systems. LG Electronics also has CDUs, the core liquid-cooling equipment for direct cooling of AI chips. Its CDU lineup includes 600MW-class small-capacity, 1MW-class medium-capacity, and 2.5MW-class large-capacity products.
LG Electronics also has cold plates for direct chip cooling. On this basis, LG Electronics has built a comprehensive 'Chip to Chiller' total cooling solution. In other words, it has a product lineup spanning traditional air-conditioning equipment, liquid-cooling equipment, and cold plates.
Based on this foundation, LG Electronics plans to provide total solutions tailored to the requirements of AI data center operators. Through this, it also plans to expand its market push.
Lee Jae-seong, head of LG Electronics' ES Business Division, said the company plans to begin full-scale supply of cooling solutions with high reliability and efficiency to global big tech companies, using the Nvidia DSX specification approval as momentum. He also said the company plans to pursue securing leadership in the next-generation liquid-cooling market.
Source: TECHWORLD · Park Gyu-chan
Original: https://www.epnc.co.kr/news/articleView.html?idxno=407250
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Source: TECHWORLD
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