Data Centers

GS Expands AI Data Center Technology Ecosystem Through Partnerships With 7 Startups

TECHWORLD ·

홍석현 GS벤처스 대표(왼쪽 첫 번째)와 도현수 GS AI인프라 대표(왼쪽 여덟 번째) 등 참석자들이 지난 15일 ‘2026 GS벤처스 테크데이’에서 기념 촬영을 하고 있다. [사진=GS]

✦ AI Summary

GS is pursuing the expansion of its ecosystem by linking startup technologies in power, memory, cooling, and operations with the group’s businesses as it builds AI data centers (AIDC).

GS Ventures held the "2026 GS Ventures Tech Day" on the 15th at GS Tower in Gangnam District, Seoul, and this year’s theme was AI data centers.

The event was attended by 7 startups and GS affiliates’ executives, who discussed technology presentations, collaboration, technology validation, and possible business linkages.

GS is pursuing the expansion of its related technology ecosystem while also building large-scale AI data centers (AIDC). Its plan is to link startup technologies in power, memory, cooling, and operations — all key areas of data centers — with the group’s businesses, with the goal of strengthening value chain competitiveness.

To that end, GS Ventures held the "2026 GS Ventures Tech Day" on the 15th at GS Tower in Gangnam District, Seoul. This year’s theme was AI data centers, and GS Ventures introduced startup technologies related to AI data centers.

A total of 7 startups participated in the event, including 6 companies in GS Ventures’ investment portfolio. The participating startups gave technology presentations, and the startups and GS affiliates discussed possible collaboration.

Chairman Huh Tae-soo of GS and executives from GS Energy, GS Caltex, GS E&C, GS E&R, and GS Global attended the event. Doh Hyun-soo, CEO of GS AI Infrastructure, the corporation dedicated to the AI data center business, also attended with working-level staff to review possible technology applications.

The participating companies unveiled solutions centered on the major technology areas of AI data centers. The technology presentations were divided into the power, memory, cooling, and operations areas that make up AI data centers.

In the power segment, Synergy introduced technologies to improve the stability of power supply and energy efficiency, while VINCEN introduced a hydrogen fuel cell solution for data centers. In memory, Exxina presented CXL(Compute Express Link)-based intelligent memory, and the focus of this technology was on easing data processing bottlenecks during large-scale AI computing.

In cooling, CoolMicro unveiled D2C(Direct-to-Chip) liquid cooling, and SDT unveiled an immersion cooling system. The D2C method removes heat by having a cooling plate directly contact the semiconductor, while the immersion cooling method cools servers by submerging them in insulating coolant. In operations, Ellis Group introduced a modular AI data center, and Vessel AI introduced GPU cloud technology specialized for AI computing tasks.

After the presentations, networking took place between GS affiliates’ business managers and the startups. At the meeting, they discussed the possibility of technology validation and business linkage.

This event is linked to the AI data center business GS is pursuing. GS plans to complete a 1.2GW data center in Donghae, Gangwon State, in stages starting in 2028, and then expand the project by an additional 1.2GW to a total of 2.4GW.

GS plans to combine its capabilities in power generation, construction, and large-scale infrastructure operations with startups’ new technologies. Through this, it aims to expand the AI data center value chain and secure infrastructure deployment, power stabilization, cooling, memory, and GPU operations technologies.

GS is focusing on improving business efficiency and scalability. Huh Tae-soo, chairman of GS, said the innovative technologies of startups could provide a clue to resolving bottlenecks in AI data center technology, and expressed his intent to jointly foster Korea’s AI data center technology ecosystem by expanding points of contact between GS and startups.

Source: TECHWORLD · Kim Seung-gi
Original: https://www.epnc.co.kr/news/articleView.html?idxno=407159

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