Infineon Launches Smart Power Stage for AI Accelerators, Achieves 2A/mm² Power Density
TECHWORLD ·
✦ AI Summary
Infineon Technologies has launched the dual-phase smart power stages TDA235E5 and TDA235E0. The product family is designed to address the power density requirements of next-generation AI accelerators and vertical power delivery (VPD) modules. The two products support up to 300A peak current and 120A total design current (TDC), and they support both horizontal and vertical power delivery configurations.
Infineon Technologies has launched the dual-phase smart power stages TDA235E5 and TDA235E0. The launch is aimed at meeting the power density requirements of next-generation AI accelerators and vertical power delivery (VPD) modules.
The product family integrates OptiMOS 6 MOSFET and a dual-phase driver IC, and its package size is 6 x 6 x 0.8 mm³. This enables power density of more than 2A/mm², and Infineon Technologies said the product family sets a new benchmark for power stage performance for high-current AI processors.
Rakesh Renganathan, vice president of Infineon's Power IC division, said Infineon customers are designing AI systems that will define the computing infrastructure of the next 10 years. He said TDA235E5 and TDA235E0 provide high power density, excellent thermal performance, and design flexibility to help designers speed product development, and that Infineon's comprehensive AI server power delivery ecosystem supports this.
The two target products, TDA235E5 and TDA235E0, support up to 300A peak current and 120A total design current (TDC). They are suitable for next-generation AI xPU accelerators and also for server CPUs in data center environments.
The two target products support both horizontal power delivery configurations and vertical power delivery configurations. As a result, based on their current support range and power delivery configuration options, the two products can be applied to both AI accelerators and data center server CPUs.
The products are designed to provide the design flexibility needed to support the transition of advanced AI processor packages to vertical power module architectures. They also feature excellent junction-to-top thermal impedance, enabling efficient integration with liquid cooling systems.
The two products can be combined with Infineon's digital multiphase controllers and support flexible, scalable multi-rail architectures. As a result, they can help shorten development cycles for rapidly evolving AI server platforms.
TDA235E5 and TDA235E0 are integrated into Infineon's AI server power delivery ecosystem. The ecosystem spans the entire power delivery chain, from the grid interface to the processor core power rails.
Infineon provides validated, scalable solutions for data center customers, and these solutions are designed by combining the strengths of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) to realize AI-optimized infrastructure. The three materials are complementary, and through them Infineon delivers the highest levels of efficiency, robustness, and power density required for AI-optimized infrastructure in data centers.
Source: TECHWORLD · Lee Gwang-jae
Original: https://www.epnc.co.kr/news/articleView.html?idxno=406941
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Source: TECHWORLD
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