EVG Solves Key Manufacturing Challenges for Next-Gen Co-Packaged Optics
TECHWORLD ·
✦ AI Summary
EVG is supporting multiple stages of the CPO manufacturing value chain based on its expertise in advanced packaging, heterogeneous integration, and photonics manufacturing.
Its support ranges from process development to high-volume manufacturing (HVM), and it helps development, optimization, and validation through the NILPhotonics competency center and the heterogeneous integration competency center.
EVG said that as AI workloads and hyperscale data center infrastructure expand, CPO architecture adoption is increasing, and that integrating photonic integrated circuits, lasers, and optical structures, along with comprehensive process expertise, is necessary.
EV Group (EVG) is supporting multiple stages of the CPO manufacturing value chain with its expertise in advanced packaging, heterogeneous integration, and photonics manufacturing. EVG's support ranges from process development to high-volume manufacturing (HVM).
EVG said it is working with customers and partners across the CPO ecosystem, with the goal of supporting the requirements of hyperscale data centers, AI infrastructure, and HPC applications.
EVG said that the explosive growth in AI workloads and hyperscale data center infrastructure has increased the need to overcome the limits of traditional copper interconnects in bandwidth, latency, power efficiency, and signal integrity, and that as a result, adoption of the CPO architecture is expanding as a response from the semiconductor industry.
CPO is an architecture that integrates photonic integrated circuits (PIC), lasers, and optical structures in the same package, effectively placing optical I/O close to computing devices.
However, these components have different physical and manufacturing characteristics, and as integration density increases, new manufacturing methods are required for effective integration. EVG is working to solve this integration challenge, and is responding with a broad portfolio of foundational technologies spanning wafer bonding, nanoimprint lithography, and thin-wafer process technologies.
Through its NILPhotonics competency center and heterogeneous integration competency center, EVG supports customers and partners in developing, optimizing, and validating new product designs and manufacturing processes under conditions close to actual mass production environments, which it says can reduce the risks associated with the transition to mass production and shorten time to market.
Bernd Dillerer, director of business development at EVG, said co-packaged optics (CPO) is a major technological shift for AI hardware, but that it also brings significant integration challenges because photonic and electronic components must be integrated using advanced packaging technology. As a result, he said, individual point solutions are not enough and comprehensive process expertise is required. He said EVG, drawing on decades of experience in the field and close collaboration through its technology competency centers, supports the development, optimization, and validation of the entire manufacturing process from the early development stage through high-volume manufacturing, enabling the successful implementation of next-generation CPO architectures.
Source: TECHWORLD · Lee Gwang-jae
Original: https://www.epnc.co.kr/news/articleView.html?idxno=406399
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Source: TECHWORLD
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