SK hynix Puts AI Server Memory on Display at Dell Event
IT DAILY ·
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SK hynix unveiled memory and storage products for AI servers and data centers at the "Dell Technologies Forum (DTF) 2026" held on the 26th at COEX in Seoul.
The lineup included HBM3E, HBM4, HBM4E, server DRAM, CXL memory modules, and eSSD, and it also featured 192GB SOCAMM2 and 256GB 3DS RDIMM and 128GB MRDIMM.
It also exhibited DDR5 RDIMM and "PS1010 E3.S" in connection with the Dell "PowerEdge R770" server, and at this year's Seoul DTF, SK hynix delivered the first partner company keynote.
SK hynix unveiled memory products for AI servers and data centers at the "Dell Technologies Forum (DTF) 2026" held on the 26th at COEX in Seoul. SK hynix has participated in the Seoul DTF since 2023.
At the event, SK hynix showcased memory and storage products for AI servers and data centers all at once. It presented the key memory products that handle computing, data processing, and storage in AI servers at the same time.
The lineup included HBM3E, HBM4, HBM4E, server DRAM and CXL memory modules, as well as eSSD for data storage. SK hynix is expanding its memory lineup for AI infrastructure, centered on HBM, server DRAM, and enterprise eSSD.
SK hynix presented computing memory, system memory, and storage together in a server environment developed in cooperation with Dell Technologies. According to the photo caption, the Dell PowerEdge R770 server was equipped with SK hynix DDR5 RDIMM and the enterprise SSD "PS1010 E3.S."
SK hynix introduced a full lineup of memory and storage products for AI, servers, and data centers. First, it unveiled HBM and 192GB SOCAMM2 as products for AI computing. SOCAMM2 is a low-power DRAM-based memory module for AI servers, and it is designed to improve power efficiency and space efficiency. SK hynix will begin mass production in April of the 192GB product, which uses 10-nanometer-class 6th-generation (1c) LPDDR5X. It also displayed 256GB 3DS RDIMM and 128GB MRDIMM as server DRAM products.
The exhibit also included second-generation CMM-DDR5 based on CXL. CXL connects processors and memory and serves to expand server memory capacity and bandwidth.
In the NAND segment, SK hynix highlighted data center eSSD as a flagship product. The unveiled products were "PEB210 E1.S," which supports direct liquid cooling (DLC), and the high-capacity, low-power "PS1110 E3.S." It also showed the QLC-based eSSD "PS1101 E3.S" as an exhibit. QLC stores 4 bits per cell, and PS1101 is the first QLC-based eSSD developed by SK hynix.
Through an exhibition combined with Dell systems, SK hynix showed how its memory and storage products are actually applied in servers. In a format introducing products used in Dell server deployments, it displayed memory and storage used in actual servers alongside Dell systems, with the linked server on display being Dell's "PowerEdge R770." The SK hynix certified product shown alongside it was 6400MT/s DDR5 RDIMM, and the product displayed with it was "PS1010 E3.S."
SK hynix participated in "Dell Technologies World 2026" held in Las Vegas in May and exhibited HBM4 and SOCAMM2 as AI memory products. Building on that, the Seoul event expanded the lineup to include server DRAM, CXL memory, and eSSD. The effect of this Seoul event was to broaden the range of products for AI infrastructure.
Against the backdrop of rising AI server workloads and growing volumes of data processed by AI servers, the importance of server DRAM performance and power efficiency, in addition to HBM, is increasing, as is the importance of storage performance and power efficiency. While continuing its strategy of securing competitiveness in AI memory centered on HBM, SK hynix is also extending its reach into server DRAM and NAND products.
At this year's Seoul DTF, SK hynix took the first partner company keynote, signaling a shift in its standing. In the keynote, Joo Young-pyo, vice president in charge of system architecture at SK hynix, said that memory technology is not highly visible externally but is the core force in the AI era that determines AI performance across the entire spectrum from storage to systems. SK hynix then explained that, based on this view, it is preparing step-by-step technological innovation to fully realize the potential of AI.
Source: IT DAILY · Kim Byeong-ju
Original: https://www.itdaily.kr/news/articleView.html?idxno=241212
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Source: IT DAILY
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