Hardware
Samsung Electro-Mechanics Wins KRW 290 Billion AI Server MLCC Order, Long-Term Contracts Top KRW 3.9 Trillion
Global Major Company Supply Expansion AI Server MLCC Share Above 40%
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Microchip and Navitas Develop 800V Power Solution for AI Data Centers
Direct Conversion from 800V to 6V ... Simplifying Power Conversion Stages
Hardware
Exina and Portray to Co-Develop CXL Memory Infrastructure for Bio Data
Verifying Spatial Omics Workloads, Pushing Ahead With Building Next-Generation MX1 Commercial Systems
Hardware
Nucode Partners With Zing Drone Solutions on Secure Wireless Module Development and Supply
Technical Cooperation Also Discussed on Defense Projects Based on Wireless Communications and Control
Hardware
AMD Says Natural Language Can Tackle HW and SW Complexity
Embedded AI Agent 'ROSS' Unveiled... RAG and MCP Combined to Block Hallucinations
Hardware
"Cloud Alone Can't Handle 86% of Inference Demand": On-Device and Edge Strategies Gain Ground
Inference Demand to Surge 30-Fold by 2030...Computing Resources Must Be Pushed to the Edge
Hardware
Arm Emerges as Standard Platform for Agentic AI
IDC: Arm-Based Rack-Scale Servers Overtake x86 in Accelerated Computing Server Market
Hardware
1 Percentage Point Gap in DRAM, 32 Percentage Point Gap in HBM... SK Hynix and Micron Diverge in Market Share
Soaring Server DRAM Prices Put Revenue Growth on Different Paths for Vendors... Micron Up 65.5%
Hardware
ASUS and Crossgen Supply High-Performance Mini PC to Ajou University Medical Center
1-Liter-Class Ultra-Compact Size, Measuring 13 cm by 13 cm by 3.4 cm ... Supports ESG Management Efforts
Hardware
TSMC May Build 6 Fabs in Texas as Second U.S. Production Hub Idea Gains Traction
Production Constraints in Taiwan and U.S. Tariff Response Could Push Investment Beyond Arizona's KRW 397 Trillion Plan: Diversifying Production Bases Amid Surging AI and HPC Demand; Actual Investment Seen After the 2030s; Taiwanese Companies Also Expand U.S. Semiconductor Materials Supply Chains
Hardware
TI Expands Zephyr RTOS Support Across Embedded Portfolio
Texas Instruments (TI) said it is expanding support for the Zephyr Project across its embedded portfolio. The integration covers the full li…
Hardware
Applied and Besi Expand Joint Development of Advanced Packaging Technologies for the AI Era
EPIC Center Innovation Partner Joins, Expanding Beyond Hybrid Bonding to Panel-Level Integration
Hardware
LG Electronics to Invest KRW 150 Billion in Chiller Production, Targeting U.S. AI Data Centers
Production to Begin in Virginia in the First Half of Next Year; Pyeongtaek and Changwon to Expand Air-Cooled Chiller Lines
Hardware
Samsung Unveils 3 New Galaxy Products: Smaller Tag, First Clip-On Buds
SmartTag3 Search Range Triples, Supports iOS... Tab S12's NPU Up 61%
Hardware
Everpure Unveils Data Management Features for Large-Scale AI Operations
Governance-Based Access and Predictable AI Costs Support the Shift to Operational Environments
Hardware
Samsung AI Learns from User Experience to Correct Itself and Act, Reducing Mistakes
Success Rates Rise With Repeated Execution, While Execution Time and Token Usage Also Decline
Hardware
TSMC’s ‘CoWoS-L’ Faces Intel’s ‘EMIB-T’ Challenge as Yield Battle Looms
Advanced Packaging Competition Intensifies as AI Chips Get Larger CoWoS-L Seen as Mainstream Through 2028 EMIB Substrate Yield Improves from 30% to 45% Korean Companies Such as Samsung Electro-Mechanics and LG Innotek Join the Race
Hardware
SemiFive, Mobilint to Co-Develop Turnkey AI Chip for Robots
SemiFive Pushes Ahead With Commercialization of K-Device AI, Expands ASIC Business Into the Physical AI Market
Hardware
SK hynix Says on Solidigm: “Nothing Has Been Decided” ... Distances Itself From ‘Dual Listing’ Concerns
“Considering the Economic Value of Existing Shareholders in a Comprehensive Way” Amid Dual Listing Concerns; Long-Term Corporate and Shareholder Value as the Decision-Making Criteria
Hardware
[Edge Infrastructure ②] Key Solutions by Company
Six Companies, Six Distinct Strategies: Dell, Lenovo, Movin, NVIDIA, Intel, and AMD